View ADMP504_8305780.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

ultralow noise microphone with bottom port and analog output data sheet ADMP504 rev. a information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that ma y result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062 - 9106, u.s.a. tel: 781.329.4700 www.analog.com fax: 781.461.3113 ? 2011 C 2012 analog devices, inc. all rights reser ved. features tiny , 3.35 mm 2.5 0 mm 0. 88 mm surface - mount package omnidirectional r esponse very h igh snr of 65 dba s ensitivity of ? 3 8 dbv extended frequency response from 100 hz to 20 khz low current consumption: 180 a single - ended analog outp ut 120 db max imum spl high psr of 7 0 db v compatible with sn/pb and pb - free solder processes rohs/weee compliant applications smartphones and feature phones tablet computers teleconferencing systems digital still and video cameras bluetooth headsets notebook pcs secur ity and surveillance functional block dia gram output amplifier ADMP504 power 10140-001 v dd gnd output figure 1. 10140-011 figure 2. isometric views of ADMP504 microphone package general description the ADMP504 1 is a high performance , very low noise, low power , analog output , bottom - ported omnidirectional mems microphone. the ADMP504 consists of a mems microphone element, an impedance converter and an output amplifier. the ADMP504 sensitivity specification makes it an excellent choice for both near field and far field applications. the ADMP504 is function - and pin - compatible with the admp4 04 microphone, providing an easy upgrade path. the ADMP504 has very high snr and extended wideband frequen cy response , resulting in natural sound with high intelligibility. low current consumption enables long battery life for portable applications . the ADMP504 complies with the tia - 920 telecommuni c ations telepho ne terminal equipment transmis sion requirements for wideband digital wireline telephones standard. the ADMP504 is available in an ultraminiature 3.35 mm 2.5 mm 0.88 mm surface - mount package. it is reflow solder compatible with no sensitivity degradation. the ADMP504 is halide free. 1 protected by u.s. patents 7,449,356; 7,825,484; 7,885,423; 7,961,897. other patents are pending.
important links for the ADMP504 * last content update 09/20/2013 09:44 pm parametric selection tables find similar products by operating parameters consider admp401: omnidirectional microphone with bottom port and analog output consider admp404: omnidirectional microphone with bottom port and analog output consider admp405: omnidirectional microphone with bottom port and analog output consider admp421: omnidirectional microphone with bottom port and analog output consider admp441: omnidirectional microphone with bottom port and analog output consider admp521: omnidirectional microphone with bottom port and analog output design tools, models, drivers & software microphone beamforming simulation tool (32-bit) - documentation for the microphone beamforming simulator microphone beamforming simulation tool (64-bit) - documentation for the microphone beamforming simulator product recommendations & reference designs cn-0262: low noise analog mems microphone and preamp with compression and noise gating cn-0207: high performance analog mems microphone's simple interface to sigmadsp audio codec suggested companion products recommended audio codecs for the ADMP504 for a low power sigmadsp codec with headphone driver and pll, we recommend the adau1761 . for a low power sigmadsp codec with mono speaker driver and pll, we recommend the adau1781 . for a low power, 24-bit audio codec with headphone driver and pll, we recommend the adau1361 . for a low power, 24-bit audio codec with a fixed-function tunable signal processor, we recommend the adau1381 . for a low power, multi-channel, 24-bit audio codec in a wafer level chip scale package, we recommend the adau1373 . for a low power, stereo codec with mono microphone input, we recommend the ssm2603 . recommended microphone preamplifiers for the ADMP504 for low noise, variable compression and noise gating, we recommend the ssm2166 or the ssm2167 . for low power, ultralow noise, low distortion, we recommend the ada4075-2 dual opamp. documentation an-1181: using a mems microphone in a 2-wire microphone circuit an-1165: op amps for mems microphone preamp circuits an-1140: microphone array beamforming an-1124: recommendations for sealing analog devices, inc., bottom- port mems microphones from dust and liquid ingress an-1112: microphone specifications explained an-1068: reflow soldering of the mems microphone an-1003: recommendations for mounting and connecting analog devices, inc., bottom-ported mems microphones cn-0262: low noise analog mems microphone and preamp with compression and noise gating adi mems mics set new bar in noise performance ug-325: analog output mems microphone flex evaluation board ms-2472: analog and digital mems microphone design considerations ms-2348: low self noise: the first step to high performance mems microphone applications ms-2275: common inter-ic digital interfaces for audio data transfer a history of consumer microphones: analog devices sets high-performance benchmark with the industrys lowest-noise mems microphone evaluation kits & symbols & footprints mems microphone evaluation boards ADMP504 flex eval board symbols and footprints design collaboration community collaborate online with the adi support team and other designers about select adi products. sample & buy ADMP504 view price & packaging request evaluation board request samples check inventory & purchase find local distributors * this page was dynamically generated by analog devices, inc. and inserted into this data sheet. note: dynamic changes to the content on this page (labeled 'important links') does not constitute a change to the revision number of the product data sheet. this content may be frequently modified. powered by tcpdf (www.tcpdf.org)
ADMP504 data sheet rev. a | page 2 of 12 table of contents features .............................................................................................. 1 applications ....................................................................................... 1 functional block diagram .............................................................. 1 general description ......................................................................... 1 revision history ............................................................................... 2 specifications ..................................................................................... 3 absolute maximum ratings ............................................................ 4 esd caution .................................................................................. 4 pin configuration and function descriptions ............................. 5 typical performance characteristics ............................................. 6 applications information ................................................................ 7 sup porting documents ................................................................7 handling instructions .......................................................................8 pick - and - place equipment ..........................................................8 reflow solder .................................................................................8 board wash ....................................................................................8 pcb land pattern layout .................................................................9 re liability specifications ................................................................ 10 outline dimensions ....................................................................... 11 ordering guide .......................................................................... 11 revision hi story 6 / 12 rev . 0 to rev. a changes to figure 2 .......................................................................... 1 changes to general description section ...................................... 1 change to power supply rejection parameter, table 1 ............... 3 changes to supporting documents section ................................. 7 changes to reflow solder section .................................................. 8 10/ 1 1 revision 0 : initial version
data sheet ADMP504 rev. a | page 3 of 12 specificati ons t a = 25c, v dd = 1.8 v , unless otherwise noted. all minimum and maximum specifications are guaranteed. typical specifications are not guaranteed. table 1 . parameter symbol test conditions /comments min typ max unit performance directionality omni sensitivity 1 khz, 94 db spl ? 41 ? 3 8 ? 3 5 dbv signal -to - noise ratio snr 20 hz to 20 khz, a - weighted 6 5 dba equivalent input noise ein 20 hz to 20 khz, a - weighted 2 9 dba spl dynamic range derived from ein and m aximum a coustic i nput 9 1 db frequency response 1 low frequency ? 3 db point 100 hz high frequency ? 3 db point > 20 khz total harmonic distortion thd 104 db spl 3 % power supply rejection ps r 217 hz, 100 mv p - p square wave superimposed on v dd = 1.8 v ? 70 db v max imum acoustic input peak , 10% thd 120 d b spl power supply supply voltage v dd 1. 6 3. 3 v supply current i s v dd = 1.8 v 180 200 a v dd = 3.3 v 200 225 a output characteristics output impedance z out 200 output dc offset 0.8 v output current limit 90 a maxim um output voltage 120 db spl input , peak 0.25 v noise floor 20 hz to 20 khz, a - weighted , rms ? 103 dbv 1 see figure 5 and figure 7 .
ADMP504 data sheet rev. a | page 4 of 12 absolute maximum rat ings table 2 . parameter rating supply voltage ? 0.3 v to + 3.6 v sound pressure level (spl) 160 db mechanical shock 1 0,000 g vibration per mil - std -883 m ethod 2007, test condition b temperature range ? 40c to + 85c stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; func tional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. esd ca ution 10140-002 t p t l t 25c t o peak t s prehe a t critica l zone t l t o t p temper a ture time ramp-down ramp-u p t smin t smax t p t l figure 3. recommended soldering profile limits table 3 . recommended soldering profile limits profile feature sn63/pb37 pb - free average ramp rate (t l to t p ) 1.25 c/sec max imum 1.25c/sec max i mum preheat minimum temperature (t smin ) 100c 15 0c maximum temperature (t smax ) 150c 200c time (t smin to t smax ), t s 60 sec to 75 sec 60 sec to 75 sec ramp - up rate (t smax to t l ) 1.25 c/sec 1.25c/sec time maintained above liquidous (t l ) 45 sec to 75 sec ~ 50 sec liquidous temperature (t l ) 183c 217c peak temperature (t p ) 215 c + 3c/?3 c 2 60 c + 0c/?5c time within 5c of actual peak temperature (t p ) 20 sec to 30 sec 20 sec to 30 sec ramp - down rate 3 c/sec max imum 3 c/sec max imum time 25c to peak temperature 5 minute s max imum 5 minute s max imum
data sheet ADMP504 rev. a | page 5 of 12 pin configuration an d function descriptions gnd output top view (terminal side down) not to scale ADMP504 1 v dd 3 2 10140-003 figure 4. pin configuration table 4 . pin function descriptions pin no. mnemonic description 1 output analog output signal 2 gnd ground 3 v dd power supply
ADMP504 data sheet rev. a | page 6 of 12 typical performance character istics ?10 ?8 ?6 ?4 ?2 0 2 4 6 8 10 100 10k 1k frequency (hz) sensitivity (db) 10140-004 figure 5. frequency response mask 0 ?80 100 10k frequency (hz) psr (db) 1k ?10 ?20 ?30 ?40 ?50 ?60 ?70 10140-005 figure 6. typical power supply rejection vs. frequency 10 ?20 20 frequency (hz) sensitivity (db) 100 1k 10k 0 5 ?10 ?5 ?15 10140-006 figure 7. typical frequency response (measured)
data sheet ADMP504 rev. a | page 7 of 12 applications information the ADMP504 output can be connected to a dedicated codec microphone input (see figure 8) or to a high input impedance gain stage (see figure 9). a 0.1 f ceramic capacitor placed close to the ADMP504 supply pin is used for testing and is recom- mended to adequately decouple the microphone from noise on the power supply. a dc-blocking capacitor is required at the output of the microphone. this capacitor creates a high-pass filter with a corner frequency at f c = 1/(2 c r ) where r is the codecs input impedance. a minimum value of 2.2 f is recommended in figure 8 because the input impedance of the adau1361 / adau1761 can be as low as 2 k at its highest pga gain setting, which would result in a high-pass filter corner frequency at about 37 hz. figure 9 shows the ADMP504 connected to an ada4897-1 op amp configured as a noninverting preamplifier. 10140-007 adau1761 or adau1361 ADMP504 gnd output linn linp micbias cm 2.2f minimum 0.1f v dd figure 8. ADMP504 connected to the analog devices adau1761 or adau1361 codec 10140-008 gain = (r1 + r2) / r1 ADMP504 gnd output 1f minimum 0.1f 10k ? r1 r2 v dd v ref v out v ref ada4897-1 figure 9. ADMP504 connected to the ada4897-1 op amp supporting documents evaluation board user guide ug-325, eval-ADMP504z-flex: bottom-ported analog output mems microphone evaluation board circuit note cn-0207, high performance analog mems microphones simple interface to sigmadsp audio codec application notes an-1003, recommendations for mounting and connecting analog devices, inc., bottom-ported mems microphones an-1068, reflow soldering of the mems microphone an-1112, microphone specifications explained an-1124, recommendations for sealing analog devices, inc., bottom-port mems microphones from dust and liquid ingress an-1140 , microphone array beamforming
ADMP504 data sheet rev. a | page 8 of 12 handling instruction s pick - and - place equipment the mems microphone can be handled using standard pick - and - place and chip shoot ing equipment. take c are to avoid damage to the mems microphone str ucture as follows: ? use a standard pickup tool to handle the microphone. because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. ? use care during pick - and - place to ens ure that no high s hock events above 1 0 k g are experienced because this may cause damage to the microphone. ? do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. do not pull air out or blow air into the microphone port. ? do not use excessive force to place the microphone on the pcb . reflow solder for best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used to attach the mems microphone to the pcb . i t is recommended that the solder reflow profile not exceed the limit conditions specified in figure 3 and table 3 . board wash when washing the pcb, ensure that water does not make contact with the micro phone port. blow - off procedures and ultrasonic cleaning must not be used.
data sheet ADMP504 rev. a | page 9 of 12 pcb land pattern layout the recommended pcb land pattern for the ADMP504 should be laid out to a 1:1 ratio to the solder pads on th e micro phone package , as shown in figure 10 . take c are to avoid applying solder paste to the sound hole in the pcb. a suggested solder paste stencil pattern layout is shown in figure 11 . the diameter of the sound hole in the pcb should be larger than the diameter of the sound port of the microphone. a minimum diameter of 0.5 mm is recommended. 10140-009 ?1.55 ?0.95 1.52 0.90 1.90 1.22 0.68 0.61 0.61 figure 10 . pcb land pattern layout 10140-010 1.22 2 0.8 0.6 0.2 45 typ 1.52mm 1.55/1.05 dia. 0.225 cut width (2) figure 11 . suggested solder paste stencil pattern layout
ADMP504 data sheet rev. a | page 10 of 12 reliability specific ations the microphone sensitivity after stress must deviate by no more than 3 db from the initial value. table 5 . stress test description low temperature operating life ? 40 c, 1000 hrs, powered high temperature operating life + 125c, 1000 hrs, powered temperature humidity bias ( thb ) + 8 5c/ + 85% relative humidity (rh), 1000 hrs, powered temperature cycle ? 40c/+125c, one cycle per hour, 1 0 00 cycles high temperature storag e + 150c, 1000 hrs low temperature storage ? 40c, 1000 hrs component cdm esd all pins, 0.5 kv component hbm esd all pins, 1.5 kv component mm esd all pins, 0.2 kv
data sheet ADMP504 rev. a | page 11 of 12 outline dimensions 2.575 2.500 2.425 3.425 3.350 3.275 06-16-2010-a t o p v i e w s i d e v i e w reference corner 0.98 0.88 0.78 0.21 ref 2.21 ref 3.06 ref 0.65 ref b o t t o m v i e w 1.08 0.95 dia. 0.25 nom 0.20 min dia. thru hole (sou nd port) 1.22 bsc 1.25 0.54 ref 0.64 ref 1.56 dia. 1.52 0.75 ref 0.30 bsc 1 3 2 0.90 0.68 (pins 1, 3) 0.20 typ 45 0.30 bsc pin 1 figure 12 . 3- terminal chip array small outline no lead cavity [lga_cav] 3.3 5 mm 2.50 mm body (ce - 3- 2) dimensions shown in millimeters ordering guide model 1 temperature range package description package option 2 ordering quantity ADMP504 acez - rl ? 40c to + 85c 3 - terminal lga_cav, 13 tape and reel ce -3 -2 10,000 ADMP504 acez - rl7 ? 40c to + 85c 3 - terminal lga_cav, 7 tape and reel ce -3 -2 1,000 eval - ADMP504 z - flex flex evaluation board 1 z = rohs compliant part. 2 this package option is halide free.
ADMP504 data sheet rev. a | page 12 of 12 notes ? 2011 C 2012 analog devices, inc. all rights reserved . trademarks and registered trademarks are the property of their respective owners. d10140 - 0 - 6/12(a)

▲Up To Search▲

Price & Availability of ADMP504

	To Download ADMP504 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .